PRODUCTION CAPABILITY
  • We continuously upgrade our manufacturing capabilities, improve on the quality of our products and services. We also upgrade our manufacturing capabilities through investments in new equipment when the need arises.

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    • Fine-Pitch SMT ability, able to mount the minimum 0201 chip and assembly technology of Pitch 0.35mm IC, PLCC, QFP, µBGA, BGA, CSP
    • Lead-Free Production
    • Chip-on-Board (COB) assembly
    • AOI, ICT, X-ray inspection
    • BGA rework
    • IC Programming
    • PCB & Components Baking
    • Components pre-forming
    • Aqueous cleaning
    • No-clean processing
    • Coating

    • JUKI2030 SMD Line x 1
    • JUKI2050 SMD Line x 1
    • JUKI2010 SMD Line x 1
    • JUKI FX-1R SMD Line x 1
    • AOI machine x 1
    • X-RAY machine x 1
    • BGA Rework Station x 1
    RoHS Tester x 1
    • ICT Testing Station x 3

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    • Operation Line x 1
    • Insertion, Soldering Line x 1
    • Lead Free Soldering Line x 1

    • Water Washing Plant
    • QE & PE Test Lab 
    • Burn In Room
    • Coating Room

     

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